Inventor · Boise, ID, US

Salman Akram

727Patents
91h-index
76Co-inventors
93Inventor score

Filing activity: Mar 7, 1994 → Sep 9, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US6235554A Method for fabricating stackable chip scale semiconductor package Electricity 674 Expired
US5739585A Single piece package for semiconductor die Emerging Cross-Sectional Technologies 523 Expired
US6013948A Stackable chip scale semiconductor package with mating contacts on opposed surfaces Electricity 456 Expired
US5674785A Method of producing a single piece package for semiconductor die Emerging Cross-Sectional Technologies 425 Expired
US5495667A Method for forming contact pins for semiconductor dice and interconnects Emerging Cross-Sectional Technologies 365 Expired
US6114240A Method for fabricating semiconductor components using focused laser beam Electricity 321 Expired
US6028365A Integrated circuit package and method of fabrication Emerging Cross-Sectional Technologies 317 Expired
US6072236A Micromachined chip scale package Electricity 314 Expired
US5483741A Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice Emerging Cross-Sectional Technologies 301 Expired
US6578458B1 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions Emerging Cross-Sectional Technologies 290 Expired
US6326698A Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices Electricity 265 Expired
US6107109A Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate Electricity 260 Expired
US5736456A Method of forming conductive bumps on die for flip chip applications Emerging Cross-Sectional Technologies 250 Expired
US5686317A Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die Emerging Cross-Sectional Technologies 245 Expired
US6169021A Method of making a metallized recess in a substrate Emerging Cross-Sectional Technologies 243 Expired
US6051878A Method of constructing stacked packages Emerging Cross-Sectional Technologies 243 Expired
US6122171A Heat sink chip package and method of making Electricity 237 Expired
US6124634A Micromachined chip scale package Electricity 229 Expired
US6294837A Semiconductor interconnect having laser machined contacts Electricity 223 Expired
US5990566A High density semiconductor package Electricity 223 Expired
US6228687A Wafer-level package and methods of fabricating Electricity 223 Expired
US6583503B2 Semiconductor package with stacked substrates and multiple semiconductor dice Emerging Cross-Sectional Technologies 218 Expired
US5946553A Process for manufacturing a semiconductor package with bi-substrate die Electricity 213 Expired
US5811879A Stacked leads-over-chip multi-chip module Electricity 207 Expired
US5994166A Method of constructing stacked packages Emerging Cross-Sectional Technologies 200 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.