Process and system for flattening secondary edgebeads on resist coated wafers
US5750317A · kind A · utility
6Cited by
2References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 16, 1994 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | Sep 16, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/168
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and system of flattening resist mounds formed during a wet edgebead operation. The wet edgebead operation is used to remove edgebeads formed when a resist material is deposited on a semiconductor wafer. Solvent is introduced to the semiconductor wafer at the area containing the resist mounds to soften them, and the semiconductor wafer is spun at a high speed to flatten the mounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.