Method and apparatus for measuring substrate temperatures
US5755511A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 1, 1996 |
| Grant date | May 26, 1998 |
| Priority date | — |
| Expiry date | May 1, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of correcting a temperature probe reading in a thermal processing chamber for heating a substrate, including the steps of heating the substrate to a process temperature; using a first, a second and a third probe to measure the temperature of the substrate, the first and third probes having a first effective reflectivity and the second probe having a second effective reflectivity, the first probe producing a first temperature indication, the second probe producing a second temperature indication and the third probe producing a third temperature indication, and wherein the first and second effective reflectivities are different; and from the first and second temperature indications, deriving a corrected temperature reading for the first probe, wherein the corrected temperature reading is a more accurate indicator of an actual temperature of the substrate than an uncorrected readings produced by both the first and second probes. Thereafter, deriving a corrected temperature reading for the third probe by adjusting the temperature correction calculated for the first probe according to the measured emissivity sensitivity associated with the environment of the third probe to prov…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.