Template rotating method for locating bond pads in an image
US5757956A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1995 |
| Grant date | May 26, 1998 |
| Priority date | — |
| Expiry date | Oct 31, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30152
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A machine vision system for identifying the locations of bonding pads on an integrated circuit mounted in a lead frame. The system involves locating the bonding pads by searching an image with suitably rotated corner templates. A set of possible candidate bonding pads is created from the location of corner templates found during the search. The set is then scored utilizing matching criteria. The best candidate is selected from the set based upon the candidates' scores. The location of the bonding pad is then generated from the best candidate's corner template locations. The invention can be beneficially applied to locate bonding pads during wire bonding, as well as other machine vision applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.