Dendritic interconnection system
US5759046A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1996 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Dec 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/02
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A technique of connecting a first member having a first face to a second member having a second face utilizing dendrites is provided. Dendrites are formed on one face of the first member in a given configuration. Dendrite receiving and securing material, preferably solder, is formed on a face of the second member in a configuration confirming substantially to the given configuration of the dendrites on the one face. The first and second members are then placed in a position relative to each other with the dendrites on the one face of the first member in contact with the dendrite receiving and engaging material on the face of the second member. An airtight seal is then provided between the first and second faces surrounding the dendrites and dendrite receiving and engaging material, which forms a sealed chamber between the first and second members. Thereafter, a vacuum is pulled within the sealed chamber, thereby causing the ambient air pressure on the two members to urge the two members toward each other which will embed the dendrites in the dendrite receiving and engaging material to form interconnection therebetween. In order to enhance or improve the bond between the dendrites a…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.