High temperature electromigration stress test system, test socket, and use thereof
US5760595A · kind A · utility
9Cited by
9References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1996 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Sep 19, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/69
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test socket is provided as part of a high temperature electromigration test system to allow the prediction of median time to failure to temperatures in excess of 450.degree. C. of VSLI interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.