Robert D. Edwards
11Patents
3h-index
30Co-inventors
60Inventor score
Filing activity: Sep 19, 1996 → Apr 5, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6383920B1 | Process of enclosing via for improved reliability in dual damascene interconnects | Electricity | 102 | Expired |
| US5760595A | High temperature electromigration stress test system, test socket, and use thereof | Physics | 9 | Expired |
| US7919834B2 | Edge seal for thru-silicon-via technology | Electricity | 3 | Active |
| US8053257B2 | Method for prediction of premature dielectric breakdown in a semiconductor | Physics | 2 | Active |
| US9673089B2 | Interconnect structure with enhanced reliability | Electricity | 2 | Active |
| US7602265B2 | Apparatus for accurate and efficient quality and reliability evaluation of micro electromechanical systems | Electricity | 1 | Active |
| US9354252B2 | Pressure sensing and control for semiconductor wafer probing | Physics | 1 | Active |
| US8912658B2 | Interconnect structure with enhanced reliability | Electricity | 1 | Active |
| US8963567B2 | Pressure sensing and control for semiconductor wafer probing | Physics | 1 | Active |
| US9059111B2 | Reliable back-side-metal structure | Electricity | 0 | Active |
| US9702930B2 | Semiconductor wafer probing system including pressure sensing and control unit | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.