Apparatus for and method for polishing workpiece
US5762539A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1997 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Feb 27, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.