Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe
US5763829A · kind A · utility
32Cited by
15References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1995 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Jul 25, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49172
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high-reliability semiconductor device and a method of producing the device. Absorption of moisture into a semiconductor device is effectively avoided by using a hard solder material, such as common solder having no moisture absorption, for die-bonding a semiconductor chip to a die pad. Thus, in the semiconductor device in accordance with the present inventions there are no corrosion problems nor package-cracking due to absorbed moisture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.