Yoshirou Nishinaka
6Patents
6h-index
11Co-inventors
52Inventor score
Filing activity: Oct 1, 1992 → Mar 31, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5900582A | Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame | Emerging Cross-Sectional Technologies | 84 | Expired |
| US5535509A | Method of making a lead on chip (LOC) semiconductor device | Emerging Cross-Sectional Technologies | 53 | Expired |
| US5372295A | Solder material, junctioning method, junction material, and semiconductor device | Electricity | 33 | Expired |
| US5763829A | Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe | Emerging Cross-Sectional Technologies | 32 | Expired |
| US5609287A | Solder material, junctioning method, junction material, and semiconductor device | Electricity | 15 | Expired |
| US5724726A | Method of making leadframe for lead-on-chip (LOC) semiconductor device | Emerging Cross-Sectional Technologies | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.