Via fill compositions for direct attach of devices and methods for applying same

US5766670A · kind A · utility

Inventors

• Roy Lynn Arldt · Georgetown, US
• Christina M. Boyko · Vestal, US
• Burtran Joe Cayson · Austin, US
• Richard Michael Kozlowski · Apalachin, US
• Joseph Duane Kulesza · Binghamton, US
• John M. Lauffer · Waverly, US
• Philip Chihchau Liu · Endwell, US
• Voya R. Markovich · Endwell, US
• Issa S. Mahmoud · Austin, US
• James Francis Muska · Johnson City, US
• Kostas Papathomas · Endicott, US
• Joseph Gene Sabia · Norwich, US
• Richard A. Schumacher · Dallas, US

Key dates

• Filing date: Nov 17, 1993
• Grant date: Jun 16, 1998
• Expiry date: Nov 17, 2013

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/25
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.