Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap
US5773195A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Jun 30, 1998 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process of forming a multi-layer electronic composite structure. At least one core including at least one functional plane of at least one electrically conducting material having a plane of at least one electrically insulating material on both sides of the at least one plane of at least one electrically conducting material is provided. The at least one core includes a plurality of plated through holes formed therethrough. A pad of an electrically-conducting material is provided over at least one of the plated through holes. The pad provides a flat surface for attaching an electronic device. The pad also prevents solder from entering the at least one plated through hole. Additionally, the pad provides an electrical connection between the electronic device and the at least one core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.