Semiconductor wafer contact system and method for contacting a semiconductor wafer

US5773986A · kind A · utility

Assignee

• Motorola, Inc. · US

Inventors

• Patrick Francis Thompson · Allen, US
• William Williams, III · Ipswich, US
• Scott E. Lindsey · Brentwood, US
• Barbara Vasquez · Austin, US

Key dates

• Filing date: Apr 3, 1995
• Grant date: Jun 30, 1998
• Expiry date: Apr 3, 2015

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/01078
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A semiconductor wafer contact system includes a sealed bladder (32) containing incompressible material. The sealed bladder (32) presses against a flexible circuit layer (28) including an array of electrical contacts (30). The bladder (32) forces the array of electrical contacts (30) against a corresponding array of device electrical contacts (12) on die (11) of a semiconductor wafer (10). The bladder (32) adapts in shape to compensate for die level and wafer level irregularities in contact height and non-parallelism. Additionally, bladder (32) ensures a constant force between membrane contacts (30) and die contacts (12), across the entire wafer (10).