Process for collective manufacture of chips with electrodes selectively covered by a deposit
US5776791A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1996 |
| Grant date | Jul 7, 1998 |
| Priority date | — |
| Expiry date | Nov 12, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC40B40/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This process comprises the following steps: PA1 a) make a set of chips (110, 111, 112, 113) on a substrate (100), each chip including a number of electrodes (110a, 110b, 111a, 111b), PA1 b) individual validity test on each chip and the formation of at least one electrical network (117a, 117b) for addressable matched electrodes on different valid chips, PA1 c) make a deposit successively on matched electrode sets by dipping the substrate in an appropriate electrochemical bath and by application of appropriate voltages on the electrical network to cause an electrochemical reaction on the electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.