Patent · US Expired

Process for collective manufacture of chips with electrodes selectively covered by a deposit

US5776791A · kind A · utility

7Cited by
9References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 12, 1996
Grant dateJul 7, 1998
Priority date
Expiry dateNov 12, 2016

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC40B40/10
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

This process comprises the following steps: PA1 a) make a set of chips (110, 111, 112, 113) on a substrate (100), each chip including a number of electrodes (110a, 110b, 111a, 111b), PA1 b) individual validity test on each chip and the formation of at least one electrical network (117a, 117b) for addressable matched electrodes on different valid chips, PA1 c) make a deposit successively on matched electrode sets by dipping the substrate in an appropriate electrochemical bath and by application of appropriate voltages on the electrical network to cause an electrochemical reaction on the electrodes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.