Directional spray pad scrubber
US5779522A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 1997 |
| Grant date | Jul 14, 1998 |
| Priority date | — |
| Expiry date | Mar 26, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B3/022
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present invention is a pad scrubber that cleans the planarizing surface of a polishing pad used in CMP processing of semiconductor wafers. The pad scrubber has a fluid manifold, a first nozzle attached to one side of the manifold, and a second nozzle attached to another side of the manifold. The first nozzle directs a first fluid stream generally outwardly toward a peripheral edge of the pad, and the second nozzle directs a second fluid stream generally outwardly to the peripheral edge of the pad and also toward the first fluid stream. The first and second fluid streams converge on the planarizing surface of the pad to separate accumulated waste matter from the polishing pad and to create a contained stream of separated particles that flows across the planarizing surface to the peripheral edge of the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.