Etching composition and use thereof
US5780363A · kind A · utility
26Cited by
26References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1997 |
| Grant date | Jul 14, 1998 |
| Priority date | — |
| Expiry date | Apr 4, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An aqueous etchant composition containing about 0.01 to about 15 percent by weight of sulfuric acid and about 0.01 to about 20 percent by weight of hydrogen peroxide or about 1 to 30 ppm of ozone is effective in removing polymer residue from a substrate, and especially from an integrated circuit chip having aluminum lines thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.