Resin sealing and molding apparatus for sealing electronic parts
US5783220A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1996 |
| Grant date | Jul 21, 1998 |
| Priority date | — |
| Expiry date | Oct 25, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3425
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin sealing and molding apparatus for electronic parts includes, a cleaning UV application mechanism for removing mold surface contaminants adhering to or accumulating on the mold surfaces. The UV application mechanism is mounted to be freely reciprocative to a retracted position not inhibiting an operation for supplying unsealed lead frames and resin tablets to each resin molding unit part and an operation for taking out sealed lead frames, and to a deployed or operating position close to the mold surfaces in each resin molding unit. Using this UV application mechanism especially in conjunction with a suction device, the mold surface contaminants, such as a; mold release agent contained in a resin material or volatile gas generated by heating, that adhere to or accumulate on the mold surfaces of each resin molding unit are efficiently and reliably removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.