Heat sink bonded to a die paddle having at least one aperture
US5783860A · kind A · utility
22Cited by
13References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 1997 |
| Grant date | Jul 21, 1998 |
| Priority date | — |
| Expiry date | Feb 4, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of bonding an integrated circuit die to a heat sink by first providing a lead frame that has a die paddle portion having a top surface, a bottom surface, and at least one aperture therethrough, positioning a heat sink abutting the bottom surface of the die paddle portion, and then pressing an integrated circuit die against the top surface of the die paddle portion with an adhesive material sandwiched therein between such that the adhesive flows through at least one aperture in the die paddle portion to bond the integrated circuit die and the heat sink together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.