Advanced copper interconnect system that is compatible with existing IC wire bonding technology
US5785236A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 1995 |
| Grant date | Jul 28, 1998 |
| Priority date | — |
| Expiry date | Nov 29, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process is provided which enables electrical connection to be formed between gold and aluminum wires and copper interconnects. Conventional techniques for wire bonding are ineffective for bonding gold wires or aluminum wires to copper pads or copper interconnects. A process is provided to modify the copper pads so that conventional wire bonding techniques can be employed. In the process of the present invention an aluminum pad is formed over the copper interconnects. The metal wire is then bonded to the aluminum pad using conventional wire bonding techniques. No new hardware and/or technology is required for the metal wire bonding. No new technology is required to integrate the process of the invention into existing IC fabrication processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.