Method for assembling a heat sink to a die paddle
US5789270A · kind A · utility
7Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 1996 |
| Grant date | Aug 4, 1998 |
| Priority date | — |
| Expiry date | Jan 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of assembly an integrated circuit die to a heat sink by first providing a lead frame that has a die-attach paddle portion having a top surface, a bottom surface, and an opening therethrough, positioning a heat sink having a raised portion on its top surface abutting the bottom surface of the die-attach paddle portion, and then frictionally engaging the heat sink and the die-attach paddle together and bonding an integrated circuit chip to the top surface of the heat sink with an adhesive material sandwiched therein between such that the assembly can be placed in a mold apparatus for forming a plastic encapsulated package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.