Gas distribution for CVD systems
US5792269A · kind A · utility
115Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1995 |
| Grant date | Aug 11, 1998 |
| Priority date | — |
| Expiry date | Oct 31, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/455
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate processing system including a vacuum chamber; a pedestal which holds a substrate during processing; and a gas distribution structure which during processing is located adjacent to and distributes a process gas onto a surface of the substrate that is held on the pedestal for processing. The gas distribution structure includes a gas distribution faceplate including a plurality of gas distribution holes formed therethrough, wherein the holes of at least a first set of the plurality of holes pass through the faceplate at angles other than perpendicular to the surface of substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.