High-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafers
US5792709A · kind A · utility
141Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1995 |
| Grant date | Aug 11, 1998 |
| Priority date | — |
| Expiry date | Dec 19, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/105
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is a high-speed planarizing machine with a platform that holds the upward facing wafer stationary during planarization, and a carrier positioned opposite the platform. The carrier rotates about an eccentric axis and translates in a plane that is substantially parallel to the wafer. A polishing pad is smaller in diameter than the wafer and is attached to the carrier and positioned opposite the wafer. The carrier rotates and translates the polishing pad across the wafer while the wafer is held stationary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.