Hugh E. Stroupe
34Patents
13h-index
12Co-inventors
74Inventor score
Filing activity: Oct 15, 1992 → Feb 26, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6410459B1 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Emerging Cross-Sectional Technologies | 522 | Expired |
| US5232875A | Method and apparatus for improving planarity of chemical-mechanical planarization operations | Emerging Cross-Sectional Technologies | 311 | Expired |
| US5792709A | High-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafers | Performing Operations; Transporting | 141 | Expired |
| US5533924A | Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers | Performing Operations; Transporting | 131 | Expired |
| US5664988A | Process of polishing a semiconductor wafer having an orientation edge discontinuity shape | Performing Operations; Transporting | 106 | Expired |
| US6103636A | Method and apparatus for selective removal of material from wafer alignment marks | Emerging Cross-Sectional Technologies | 66 | Expired |
| US6653722B2 | Method for applying uniform pressurized film across wafer | Electricity | 41 | Expired |
| US5807767A | Technique for attaching die to leads | Electricity | 31 | Expired |
| US6069028A | Technique for attaching die to leads | Electricity | 19 | Expired |
| US6472725B1 | Technique for attaching die to leads | Electricity | 19 | Expired |
| US6316363A | Deadhesion method and mechanism for wafer processing | Performing Operations; Transporting | 17 | Expired |
| US5945729A | Technique for attaching die to leads | Electricity | 15 | Expired |
| US6329301A | Method and apparatus for selective removal of material from wafer alignment marks | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6506679B2 | Deadhesion method and mechanism for wafer processing | Performing Operations; Transporting | 9 | Expired |
| US6380086B1 | High-speed planarizing apparatus for chemical-mechanical planarization of semiconductor wafers | Performing Operations; Transporting | 8 | Expired |
| US6518172B1 | Method for applying uniform pressurized film across wafer | Electricity | 8 | Expired |
| US6309913A | Technique for attaching die to leads | Electricity | 7 | Expired |
| US6307254A | Technique for attaching die to leads | Electricity | 6 | Expired |
| US6555897B2 | Assembly for attaching die to leads | Electricity | 5 | Expired |
| US6610610B2 | Methods for selective removal of material from wafer alignment marks | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6828227B2 | Method for applying uniform pressurized film across wafer | Electricity | 4 | Expired |
| US7135763B2 | Technique for attaching die to leads | Electricity | 4 | Expired |
| US6530113B2 | Apparatus for selective removal of material from wafer alignment marks | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6429146B2 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6882032B2 | Technique for attaching die to leads | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.