Integrated circuit chip to substrate interconnection and method
US5795818A · kind A · utility
76Cited by
33References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 6, 1996 |
| Grant date | Aug 18, 1998 |
| Priority date | — |
| Expiry date | Dec 6, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interconnection between bonding pads on an integrated circuit chip and corresponding bonding contacts on a substrate are formed. To form the interconnection, a metallization is formed on each of the substrate bonding contacts. Metal ball bond bumps are formed on selective ones of the bonding pads and then coined. The substrate and integrated circuit chip are heated. The coined ball bond bumps are then placed into contact with the corresponding metallizations, pressure and ultrasonic energy are applied, and a metal-to-metal bond is formed between each coined ball bond bump and the corresponding metallization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.