Wafer heater assembly
US5796074A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 1995 |
| Grant date | Aug 18, 1998 |
| Priority date | — |
| Expiry date | Nov 28, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4586
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A wafer heater assembly (8) for a deposition/etch chamber (2) includes a base (32) and a wafer support or chuck (36), having a wafer-chucking surface (76), spaced apart from the base by a circumferential barrier support (38). A heater sub-assembly (54) is mounted to the wafer support. Bolts (48) are used to secure the wafer support to the base with the barrier support therebetween to press the barrier support against an elastomeric O-ring, a metal V-seal or other fluid seal (46) positioned between the base and base end (42) of the barrier support. This eliminates the need to discard the entire heater assembly if the dielectric wafer-chucking surface becomes damaged. The temperature of the fluid seal is about 50.degree.-70.degree. C. lower than the temperature of the wafer-chucking surface when the wafer-chucking surface is about 200.degree.-300.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.