Polishing system
US5797789A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 1997 |
| Grant date | Aug 25, 1998 |
| Priority date | — |
| Expiry date | Mar 5, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing system for polishing a wafer or the like, comprises: a vacuum system comprising a vacuum pump and a vacuum passage connected thereto; a fluid supply system comprising a fluid source and a fluid passage connected thereto; a polishing head comprising a holding member for holding the wafer or the like on the lower surface thereof which has at least one through hole in communication with the vacuum passage and the fluid passage; and a polishing member. Polishing of the wafer or the like is performed by pressing the wafer or the like held on the lower surface of the holding member, against the polishing member while providing relative motion between the holding member and the polishing member and supplying an abrasive slurry to the polishing member. Separation of the wafer or the like from the polishing head is performed by injecting a fluid from the fluid supply system to the object through the through hole of the holding member. A gelation suppression member for suppressing gelation of the abrasive slurry sucked into the through hole or the vacuum passage is provided in the course of the vacuum passage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.