Tsutomu Takaku
6Patents
5h-index
10Co-inventors
49Inventor score
Filing activity: Jul 29, 1996 → Mar 5, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5797789A | Polishing system | Performing Operations; Transporting | 52 | Expired |
| US5733177A | Process of polishing wafers | Performing Operations; Transporting | 27 | Expired |
| US6306021A | Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafers | Performing Operations; Transporting | 16 | Expired |
| US6190238A | Polishing pad, method and apparatus for treating polishing pad and polishing method | Performing Operations; Transporting | 12 | Expired |
| US6060396A | Polishing agent used for polishing semiconductor silicon wafers and polishing method using the same | Electricity | 7 | Expired |
| US5934981A | Method for polishing thin plate and apparatus for polishing | Performing Operations; Transporting | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.