Multilayer printed wiring board and process for manufacturing the same
US5800722A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 1, 1996 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | May 1, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0315
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed wiring board wherein an inner-layer copper circuit is provided on one or both of the surfaces of an inner-layer substrate, and subsequent copper circuit is cumulatively provided through an insulating layer on the outside of the inner-layer copper circuit, characterized in that the inner-layer copper circuit has a cuprous oxide film formed on the surface thereof the insulating layer which remarkably facilitate the interlayer adhesion between the inner-layer copper circuit. This multilayer printed wiring board has high interlayer adhesiveness and moistureproofness without causing any haloing phenomena when soaked with an acidic solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.