Positive photoresist composition
US5800966A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1993 |
| Grant date | Sep 1, 1998 |
| Priority date | — |
| Expiry date | Apr 9, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0236
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This invention provides a positive photoresist composition comprising an alkali-soluble resin, a dissolution inhibitor and a photo-induced acid precursor, wherein said alkali-soluble resin is obtainable through a condensation reaction of a compound represented by the general formula (I): ##STR1## wherein R.sub.1 to R.sub.9 each represent hydrogen atom, halogen atom, alkyl group, alkenyl group, --OH group or the like, provided that at least one of R.sub.1 to R.sub.9 is --OH group and at least two hydrogen atoms are attached to the o- or p-position of the --OH group, and an aldehyde. This positive photoresist composition is excellent in performances such as resolution, profile, sensitivity, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.