Contact carriers (tiles) for populating larger substrates with spring contacts
US5806181A · kind A · utility
304Cited by
18References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1997 |
| Grant date | Sep 15, 1998 |
| Priority date | — |
| Expiry date | Jan 24, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to making temporary, pressure connections between electronic components and, more particularly, to techniques for performing test and burn-in procedures on semiconductor devices prior to their packaging, preferably prior to the individual semiconductor devices being singulated from a semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.