Socket for engaging bump leads on a microelectronic device and methods therefor
US5810609A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1995 |
| Grant date | Sep 22, 1998 |
| Priority date | — |
| Expiry date | Aug 28, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connector for microelectronic devices having bump leads and methods for fabricating and using the connector. A dielectric substrate has a plurality of posts extending upwardly from a front surface. The posts may be arranged in an array of post groups each group defining a gap therebetween. A generally laminar contact extends from each post top. The bump leads are each inserted within a respective gap thereby engaging the contacts which wipe against the bump lead as it continues to be inserted. Typically, distal portions of the contacts deflect downwardly toward the substrate and outwardly away from the center of the gap as the bump lead is inserted into a gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.