Vacuum processing device and film forming device and method using same
US5815396A · kind A · utility
29Cited by
12References
48Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 1995 |
| Grant date | Sep 29, 1998 |
| Priority date | — |
| Expiry date | May 9, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67098
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to vacuum processing equipment for processing a wafer in a vacuum, and film coating or forming equipment and method for forming a film on a wafer wherein radiation measurement and temperature control of the wafer is carried out by using an infrared radiation thermometer. Based upon the radiation measurement, heating and/or cooling of the wafer during processing is carried out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.