Circuitized substrate with same surface conductors of different resolutions
US5817405A · kind A · utility
14Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 1997 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | Feb 4, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for making a circuitized substrate is defined wherein the substrate is treated with two different, e.g., additive and subtractive, metallization processes. The process is thus able to effectively produce substrates including conductive features, e. g., high density circuit lines and chip heat-sinking pads, of two different degrees of resolution in a cost effective and expeditious manner. The resulting product is also defined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.