Method of fabricating flip-chip on leads devices and resulting assemblies
US5817540A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 20, 1996 |
| Grant date | Oct 6, 1998 |
| Priority date | — |
| Expiry date | Sep 20, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die assembly and methods of forming same comprising a lead frame having a plurality of lead fingers and a semiconductor die having a plurality of electric contact points on an active surface of said semiconductor die. The electric contact points are located or rerouted on the semiconductor die active surface so as to maximize the size and spacing of electric contact points relative to the lead fingers, which may be custom-configured to match the "open" array of contact points and widened to enhance surface area for connection thereto. This arrangement results in large and robust flip-chip type interconnections between the electric contact points and the lead frame, eliminating the need for wirebonding and for adhesive connections of the lead frame to the die active surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.