Inventor · Boise, ID, US

James M. Wark

173Patents
38h-index
30Co-inventors
90Inventor score

Filing activity: Mar 7, 1996 → Aug 21, 2018

Most-cited inventions

PatentTitleAreaCited byStatus
US6841883B1 Multi-dice chip scale semiconductor components and wafer level methods of fabrication Electricity 455 Expired
US7498675B2 Semiconductor component having plate, stacked dice and conductive vias Electricity 273 Active
US5817540A Method of fabricating flip-chip on leads devices and resulting assemblies Electricity 232 Expired
US5973403A Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Emerging Cross-Sectional Technologies 189 Expired
US5866953A Packaged die on PCB with heat sink encapsulant Electricity 177 Expired
US5696031A Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice Emerging Cross-Sectional Technologies 152 Expired
US6060769A Flip-chip on leads devices Electricity 136 Expired
US7300857B2 Through-wafer interconnects for photoimager and memory wafers Electricity 135 Expired
US6025730A Direct connect interconnect for testing semiconductor dice and wafers Physics 126 Expired
US5931685A Interconnect for making temporary electrical connections with bumped semiconductor components Electricity 121 Expired
US6078186A Force applying probe card and test system for semiconductor wafers Physics 120 Expired
US5915977A System and interconnect for making temporary electrical connections with bumped semiconductor components Electricity 118 Expired
US6165814A Thin film capacitor coupons for memory modules and multi-chip modules Emerging Cross-Sectional Technologies 117 Expired
US5929521A Projected contact structure for bumped semiconductor device and resulting articles and assemblies Emerging Cross-Sectional Technologies 111 Expired
US5893726A Semiconductor package with pre-fabricated cover and method of fabrication Electricity 110 Expired
US6613662B2 Method for making projected contact structures for engaging bumped semiconductor devices Emerging Cross-Sectional Technologies 98 Expired
US5982018A Thin film capacitor coupons for memory modules and multi-chip modules Emerging Cross-Sectional Technologies 86 Expired
US5952840A Apparatus for testing semiconductor wafers Physics 86 Expired
US5894218A Method and apparatus for automatically positioning electronic dice within component packages Emerging Cross-Sectional Technologies 85 Expired
US6252308A Packaged die PCB with heat sink encapsulant Electricity 72 Expired
US5766982A Method and apparatus for underfill of bumped or raised die Electricity 71 Expired
US6072323A Temporary package, and method system for testing semiconductor dice having backside electrodes Physics 68 Expired
US6057597A Semiconductor package with pre-fabricated cover Electricity 61 Expired
US5907492A Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs Electricity 60 Expired
US6342724B1 Thin film capacitor coupons for memory modules and multi-chip modules Emerging Cross-Sectional Technologies 59 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.