Boat for heat treatment
US5820367A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 18, 1996 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Sep 18, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B25/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Support members are provided in a vertically spaced relation on a plurality of upright columns. A wafer support member comprises a projection formed to be annular along an inner peripheral edge of a ring and an outer wall formed along an outer peripheral edge thereof. The wafer is positively supported at a position inwardly of the outer peripheral edge thereof by the projection of the wafer support member despite the presence or absence of a warp thereof. Therefore, a load caused by the weight of the wafer is dispersed over the entire projection of the wafer support member. This suppresses the concentration of stress on a specific portion of the wafer support portion, and a surface defect called a slip generated when the wafer is heat treated can be eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.