Probe card device used in probing apparatus
US5825192A · kind A · utility
53Cited by
7References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 11, 1996 |
| Grant date | Oct 20, 1998 |
| Priority date | — |
| Expiry date | Jul 11, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07378
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card device used in a probing apparatus for testing the electrical characteristics of a semiconductor wafer by bringing bump electrodes into contact with a plurality of electrode pads of the wafer comprises a probe card, a support block for supporting the probe card, and a pushing mechanism for pushing the probe card toward the wafer. The pushing mechanism includes a pushing member divided into a plurality of blocks, and a support member for supporting each of the divided blocks. These plural blocks are movable independently and serve to push the wafer in a manner to follow a surface profile of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.