Method and apparatus for mechanical polishing
US5833519A · kind A · utility
93Cited by
9References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 6, 1996 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Aug 6, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Method and apparatus for conditioning a polishing pad. In particular, a check loop system and associated code are described for monitoring force applied on a pad from an end effector attached to an arm. The pad is conditioned by the end effector for mechanical polishing to remove matter from a substrate assembly. This may be done with chemical-mechanical-polishing and is often used for planarization of a substrate assembly. Described are a modular turret and drive system which are used to manipulate an end effector over a pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.