Method of producing a semiconductor wafer using ultraviolet sensitive tape
US5840614A · kind A · utility
28Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 1996 |
| Grant date | Nov 24, 1998 |
| Priority date | — |
| Expiry date | Nov 7, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/6834
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for producing semiconductor devices using ultraviolet sensitive tape including the steps of forming a plurality of chips on a first surface of a semiconductor wafer, adhering an ultraviolet sensitive tape to the first surface of the semiconductor wafer, back lapping a second surface of the wafer, opposite to the first surface, and irradiating the ultraviolet sensitive tape with ultraviolet rays to release the ultraviolet sensitive tape from the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.