Heated substrate support structure
US5844205A · kind A · utility
54Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1996 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Apr 19, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B25/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heated substrate support plate for use in a process chamber. The support plate has grooves disposed therein for receiving heating elements. The heating elements are comprised of an outer sheath, a heater coil and a heat-conducting filler material. The heating element is disposed within a groove and compressed to compact the heat-conducting filler material about the heater coil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.