Photoresist composition
US5846688A · kind A · utility
4Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 1996 |
| Grant date | Dec 8, 1998 |
| Priority date | — |
| Expiry date | May 10, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive-working photoresist composition which exhibits a high sensitivity and a high resolution in addition to excellent characteristics such as heat resistance, film retention ratio, coatability and profile; PA1 which comprises an alkali-soluble resin comprising a polyvinylphenol resin which is polyvinylphenol and/or its partially hydrogenated product in which the phenolic hydroxyl groups are partially alkyletherified and partially protected; PA1 and a sulfonate of a N-hydroxyimide compound as an acid generator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.