Semiconductor wafer support with graded thermal mass
US5848889A · kind A · utility
41Cited by
6References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 1996 |
| Grant date | Dec 15, 1998 |
| Priority date | — |
| Expiry date | Jul 24, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An annular-shaped edge ring support for a semiconductor wafer has an innermost radial portion for supporting the semiconductor wafer and an outermost radial portion contiguous with the inner portion. The inner portion has a graded thermal mass that generally increases with increasing radius.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.