Method of making grid array assembly
US5852870A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 1996 |
| Grant date | Dec 29, 1998 |
| Priority date | — |
| Expiry date | Apr 24, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A grid array assembly method uses a semi-flexible substrate printed circuit board and includes steps of providing a series of conforming boards each board including bonding pads and metallization on a first surface and conductive vias in the board extending to a second opposite surface containing a contact pad array, testing the boards and determining acceptable boards. A carrier strip with longitudinally aligned apertures mounts individual accepted boards. The strip with mounted boards is passed to a station where an IC die is mounted on the board first surface, wire bonds are placed from the die to the bonding pads and the assembly encapsulated by automolding against a board first surface portion using the strip as the mold gate to form a package body. Subsequently interconnecting balls or bumps are placed on the contact pads and the assembly is removed from the strip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.