John Briar
20Patents
10h-index
13Co-inventors
68Inventor score
Filing activity: Mar 16, 1994 → Oct 24, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6329606A | Grid array assembly of circuit boards with singulation grooves | Emerging Cross-Sectional Technologies | 222 | Expired |
| US5635671A | Mold runner removal from a substrate-based packaged electronic device | Electricity | 68 | Expired |
| US6432742B1 | Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages | Electricity | 47 | Expired |
| US6255143A | Flip chip thermally enhanced ball grid array | Electricity | 39 | Expired |
| US5852870A | Method of making grid array assembly | Emerging Cross-Sectional Technologies | 34 | Expired |
| US6750082B2 | Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip | Electricity | 33 | Expired |
| US6479903B2 | Flip chip thermally enhanced ball grid array | Electricity | 29 | Expired |
| US6544812B1 | Single unit automated assembly of flex enhanced ball grid array packages | Electricity | 19 | Expired |
| US6355199B1 | Method of molding flexible circuit with molded stiffener | Electricity | 15 | Expired |
| US6168975A | Method of forming extended lead package | Electricity | 13 | Expired |
| US6103550A | Molded tape support for a molded circuit package prior to dicing | Electricity | 10 | Expired |
| US6372553B1 | Disposable mold runner gate for substrate based electronic packages | Electricity | 8 | Expired |
| US6537857B2 | Enhanced BGA grounded heatsink | Electricity | 7 | Expired |
| US6759752B2 | Single unit automated assembly of flex enhanced ball grid array packages | Electricity | 6 | Expired |
| US6660565B1 | Flip chip molded/exposed die process and package structure | Electricity | 5 | Expired |
| US6617525B2 | Molded stiffener for flexible circuit molding | Electricity | 3 | Expired |
| US7081668B2 | Flip chip molded/exposed die process and package structure | Electricity | 2 | Expired |
| US6543127B1 | Coplanarity inspection at the singulation process | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6828671B2 | Enhanced BGA grounded heatsink | Electricity | 1 | Expired |
| US6770962B2 | Disposable mold runner gate for substrate based electronic packages | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.