Resist processing method and apparatus
US5853803A · kind A · utility
7Cited by
6References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 5, 1997 |
| Grant date | Dec 29, 1998 |
| Priority date | — |
| Expiry date | Nov 5, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of resist-processing a rectangular substrate including a resist coating step of supplying resist solution to the substrate, while rotating it, to form resist film at least on one surface of it and a resist removing step of jetting removing liquid, which can solve resist, to both surfaces of it at its side peripheral portions to remove the resist film from them.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.