Method and apparatus for mounting electronic component
US5854745A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1995 |
| Grant date | Dec 29, 1998 |
| Priority date | — |
| Expiry date | Mar 30, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
When an electronic component is picked up at an electronic component feeding part and then positioned and mounted at a predetermined mounting position on a transparent panel, mounting position marks formed at the mounting position on the transparent panel are registered with positioning marks formed on the electronic component, to thereby recognize the relative position from a surface opposite to a surface of the transparent panel where the electronic component is to be mounted, so that the position of the electronic component is corrected based on the result of the recognition before the electronic component is mounted at the predetermined mounting position on the transparent panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.