Shinzo Eguchi
5Patents
4h-index
20Co-inventors
49Inventor score
Filing activity: Mar 30, 1995 → Oct 17, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5854745A | Method and apparatus for mounting electronic component | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6439447B1 | Bump joining judging device and method, and semiconductor component production device and method | Electricity | 12 | Expired |
| US5899140A | Bump levelling method and bump levelling apparatus | Electricity | 5 | Expired |
| US6328196A | Bump bonding device and bump bonding method | Electricity | 4 | Expired |
| US6481616B2 | Bump bonding device and bump bonding method | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.