Method and apparatus for stopping mechanical and chemical-mechanical planarization of substrates at desired endpoints
US5855804A · kind A · utility
84Cited by
3References
28Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 6, 1996 |
| Grant date | Jan 5, 1999 |
| Priority date | — |
| Expiry date | Dec 6, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for forming a planar surface on a substrate at a desired endpoint. In one embodiment of the invention, material is removed from a substrate with an abrasive medium on a planarizing surface. As material is removed from the substrate, the abrasive medium is selectively inhibited from contacting a first exposed area at the desired endpoint on the substrate while it still contacts a second area on the substrate that is not yet at the endpoint. In this embodiment of the invention, therefore, polishing substantially stops at the first area on the substrate but continues at the second area on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.