Demountable and repairable low pitch interconnect for stacked multichip modules
US5857858A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1996 |
| Grant date | Jan 12, 1999 |
| Priority date | — |
| Expiry date | Dec 23, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/403
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Connection elements which, for example, may be used to facilitate interconnection to and stacking of electronic assemblies or may include an elongated conductive core, such as a wire or a hollow tube structure, coated with a layer of elastomeric material containing conductive particle such that the elastomeric material is conductive at least when compressed. The substrates of multi-chip modules (MCMs) have electrical connection sites in the form of metal-lined channels in the substrate edges, and the connection elements are pressed into the channels. Separate compression or clamping elements may be employed to enhance conductivity, as well as to facilitate external connections. The elongated conductive core may take the form of a hollow tube structure which may be expanded under internal pressure to compress the layer of elastomeric material. The compression elements may take the form of printed circuit boards. In alternative embodiments the connection elements may be clamped between conductive channels of side-by-side substrates or between opposed conductive channels of stacked substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.