Method of and apparatus for dressing polishing cloth
US5857898A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1997 |
| Grant date | Jan 12, 1999 |
| Priority date | — |
| Expiry date | Nov 19, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing cloth is dressed between polishing processes each for polishing a workpiece such as a semiconductor wafer. The polishing cloth is dressed while supplying a dressing liquid such as water during a dressing process, and an abrasive liquid for polishing a workpiece is supplied to the polishing cloth for a predetermined period of time prior to a polishing process. The predetermined period of time may be present within the dressing process and immediately precedes the polishing process, and the dressing process may be carried out while supplying the abrasive liquid to the polishing cloth. Alternatively, the predetermined period of time may be present between the dressing process and the polishing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.